Huizhou Preferred Cooling Copper Foil Price
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above shall not exceed 8 penetration points within the area of 300ram × 300mm; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
Huizhou Preferred Cooling Copper Foil Price
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality.
Huizhou Preferred Cooling Copper Foil Price
Small dirt, small exclamation mark. During the production of raw foil, the hair side is upward, and the dirt in liquid and air all fall on the hair side, which is printed on the smooth side after rolling. The reason is that the stains on the cathode roll are not dried. The surface temperature of the cathode roll is only 50 degrees, and the air temperature in the workshop is generally about 25 degrees. The surface hairiness is very good. The dirt itself has water, and the drying time is only 2-3 minutes. Therefore, the dirt on the copper foil cannot be completely dried.
Huizhou Preferred Cooling Copper Foil Price
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
