Huaibei chooses the best copper foil manufacturer for heat dissipation
The commonly used reinforcement materials of copper clad laminate are alkali free (alkali metal oxide content shall not exceed 0.5%) glass fiber products (such as glass cloth, glass felt) or paper (such as wood pulp paper, bleached wood pulp paper, cotton wool paper). Therefore, laminates can be divided into glass cloth base and paper base.
Huaibei chooses the best copper foil manufacturer for heat dissipation
Galvanizing barrier layer: After the rough surface is galvanized, a barrier layer is formed to improve the oxidation resistance of the copper foil in natural air. After galvanizing, the appearance will look gray. After a period of storage, the gray will turn into copper yellow. The more zinc is plated, the more yellow the copper foil will be.
Huaibei chooses the best copper foil manufacturer for heat dissipation
Calendered copper foil is the original foil made from copper plate by repeated rolling, and then roughened according to requirements. Due to the limitation of processing technology, its width is difficult to meet the requirements of rigid copper clad laminate, so calendered copper foil is rarely used on rigid copper clad laminate; However, because the bending resistance and elastic coefficient are greater than electrolytic copper foil, they are often used on flexible copper clad laminate.
Huaibei chooses the best copper foil manufacturer for heat dissipation
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
