Nantong optimized pcb copper foil processing
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Nantong optimized pcb copper foil processing
The technical feature of electrolytic copper foil is that various technical conditions in electrolyte and additives must be strictly controlled, so equipment alone is not enough to produce high-performance copper foil; High performance has high requirements for the materials of anode plate and cathode roll in the raw foil equipment, the processing accuracy and consistency of the equipment; In the production process, the concentration of copper and acid in the electrolyte needs to be monitored and adjusted in real time.
Nantong optimized pcb copper foil processing
With the further competition in the market, even those with high added value have to be controlled from the production cost. Because the production requires very strict cleanliness of its electrolytic solution (copper sulfate solution), many filtration systems and liquid feeding pumps are repeatedly used in previous production processes. A new process flow is provided here, which can fundamentally control product quality and reduce production costs.
Nantong optimized pcb copper foil processing
The copper clad laminate is composed of copper foil, reinforcement material and adhesive. Plates are usually classified according to the reinforcement material category and adhesive category or plate characteristics.
