Changzhou Preferred Lithium Battery Copper Foil Processing
Ultra thin copper foil is used for portable electronic products such as mobile phones and laptops. Multilayer boards containing micro buried and blind vials and BGA, CSP and other organic resin packaging substrates are used to promote thin foil and ultra-thin foil. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Changzhou Preferred Lithium Battery Copper Foil Processing
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Changzhou Preferred Lithium Battery Copper Foil Processing
Copper foil can be divided into many kinds according to different classifications. According to the thickness, it can be divided into: thickness (more than 70 μ m) Regular thickness copper foil (more than 18 μ M but less than 70 μ m) Thin copper foil (more than 12 μ M but less than 18 μ m) Ultra thin copper foil (less than 12 μ m) Etc.
Changzhou Preferred Lithium Battery Copper Foil Processing
The copper clad laminate is composed of copper foil, reinforcement material and adhesive. Plates are usually classified according to the reinforcement material category and adhesive category or plate characteristics.
