Ganzhou Preferred Copper Foil Manufacturer for Heat Dissipation
The electrolyte contains oil, paint, grease, sediment and other contaminants attached to the surface of copper foil. After being squeezed by the squeezing (water) roller, the contaminants are squeezed flat, some contaminants attach to it, and some contaminants attach to the guide roller. Because the dirt is squeezed up during the operation, the dirt has a head and a tail, and has a direction.
Ganzhou Preferred Copper Foil Manufacturer for Heat Dissipation
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
Ganzhou Preferred Copper Foil Manufacturer for Heat Dissipation
Copper foil is an indispensable raw material for making printed circuit board (PCB), copper clad plate (CCL) and lithium-ion battery. For industrial use, it can be divided into calendered copper foil and two categories according to its manufacturing process. Electrolytic copper foil is made by electrolysis of copper based on electrochemical principle. The internal structure of raw foil is vertical acicular crystal structure, and its production cost is relatively low.
Ganzhou Preferred Copper Foil Manufacturer for Heat Dissipation
Most copper foils used for domestic printed boards are 35um thick, and 50um copper foils are used as transition products. In high-precision hole metallized double-sided or multilayer board manufacturing, thinner than 35um copper foils, such as 18um, 9um and 5um copper foils, are expected. Some multilayer boards use thicker copper foil, such as 70um.
Ganzhou Preferred Copper Foil Manufacturer for Heat Dissipation
Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.
