Foil processing of Foshan Preferred Circuit Board
Electrolytic copper foil is made by dissolving copper into copper sulfate solution, electrodepositing the copper sulfate electrolyte under the action of direct current in special electrolytic equipment to make the original foil, and then carrying out surface treatment, heat-resistant layer treatment, oxidation prevention treatment and other surface treatment processes on the original foil according to customer requirements.
Foil processing of Foshan Preferred Circuit Board
Copper foil can be divided into calendered copper foil and electrolytic copper foil, which are mainly used for flexible printed circuits and other special purposes. In the production of clad laminates, a large number of applications are. As for the purity of copper, IEC-249-34 and Chinese standards stipulate that it shall not be lower than 99.8%.
Foil processing of Foshan Preferred Circuit Board
Silane coupling agent treatment: after anti oxidation treatment, the surface is sprayed with silane, which can improve the oxidation resistance at room temperature on the one hand; On the other hand, in high temperature pressing plate, silane can better combine copper foil and resin substrate through coupling, and improve peel strength. Post treatment process - drying. In order to prevent the harm of residual moisture, it must be dried at not less than 100 ℃ later, and the drying temperature cannot be too high.
Foil processing of Foshan Preferred Circuit Board
Small dirt, small exclamation mark. During the production of raw foil, the hair side is upward, and the dirt in liquid and air all fall on the hair side, which is printed on the smooth side after rolling. The reason is that the stains on the cathode roll are not dried. The surface temperature of the cathode roll is only 50 degrees, and the air temperature in the workshop is generally about 25 degrees. The surface hairiness is very good. The dirt itself has water, and the drying time is only 2-3 minutes. Therefore, the dirt on the copper foil cannot be completely dried.
Foil processing of Foshan Preferred Circuit Board
The copper clad laminate is composed of copper foil, reinforcement material and adhesive. Plates are usually classified according to the reinforcement material category and adhesive category or plate characteristics.
