Zhongshan Preferred Circuit Board Copper Foil Manufacturer
Speaking saliva splashes on the surface, and stains will appear when saliva is rolled up. A short time is a dark point, and a long time is a dark point. The size of the point is related to the saliva splashed on the copper foil.
Zhongshan Preferred Circuit Board Copper Foil Manufacturer
In order to improve the bonding strength of copper foil to the substrate, oxidation is usually used (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is formed on the surface, which improves the bonding strength of copper foil and substrate due to the polarity) Or roughen the copper foil (a roughened layer is generated on the surface of the copper foil by electrochemical method, which increases the surface area of the copper foil and improves the bonding strength between the copper foil and the substrate due to the anchoring effect of the roughened layer on the substrate).
Zhongshan Preferred Circuit Board Copper Foil Manufacturer
Galvanizing barrier layer: After the rough surface is galvanized, a barrier layer is formed to improve the oxidation resistance of the copper foil in natural air. After galvanizing, the appearance will look gray. After a period of storage, the gray will turn into copper yellow. The more zinc is plated, the more yellow the copper foil will be.
Zhongshan Preferred Circuit Board Copper Foil Manufacturer
Definition of electrolytic copper foil: it is formed by depositing copper ions in electrolyte on the round cathode roller of smooth rotating stainless steel plate (or titanium plate). The surface close to the cathode roller is called smooth surface, and the other surface is called rough surface.
Zhongshan Preferred Circuit Board Copper Foil Manufacturer
Copper foil is divided into calendered copper foil and electrolytic copper foil according to the preparation process, which accounts for the vast majority of the market. According to the Copper Foil Branch of China Electricity Association (CCFA), at present, domestic manufacturers mainly focus on the production of electrolytic copper foil. In 19 years, the domestic production capacity of electrolytic copper foil is expected to be close to 600000 tons, while that of rolled copper foil is only about 10000 tons.
Zhongshan Preferred Circuit Board Copper Foil Manufacturer
Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.
