Dongguan Preferably Selects Ultra thin Copper Foil Manufacturers
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Dongguan Preferably Selects Ultra thin Copper Foil Manufacturers
Speaking saliva splashes on the surface, and stains will appear when saliva is rolled up. A short time is a dark point, and a long time is a dark point. The size of the point is related to the saliva splashed on the copper foil.
Dongguan Preferably Selects Ultra thin Copper Foil Manufacturers
The technical feature of electrolytic copper foil is that various technical conditions in electrolyte and additives must be strictly controlled, so equipment alone is not enough to produce high-performance copper foil; High performance has high requirements for the materials of anode plate and cathode roll in the raw foil equipment, the processing accuracy and consistency of the equipment; In the production process, the concentration of copper and acid in the electrolyte needs to be monitored and adjusted in real time.
Dongguan Preferably Selects Ultra thin Copper Foil Manufacturers
Surface passivation: chromate (or chromate and zinc salt) solution is used for surface passivation (i.e. anti oxidation treatment) after the barrier layer is plated to form a complex film with chromium (or chromium zinc) as the main body on the surface, so that the copper foil will not be oxidized and discolored due to direct contact with air, and at the same time, the heat resistance of the copper foil is improved (higher zinc content, better heat resistance), The storage period of copper foil can reach 3 months.
