Suzhou preferred electrolytic copper foil manufacturer
The production of extremely thin copper foil has high barriers, and the products produced still need to meet many requirements of downstream lithium ion battery manufacturers. For investors, they should not only focus on the single index of thickness, not all manufacturers produce 6 μ M Copper foil is consistent, and the thinner the better.
Suzhou preferred electrolytic copper foil manufacturer
Electronic circuit copper foil plays an important role in conducting electricity and heat in printed circuit board (PCB), and is known as the neural network on PCB. At present, copper foil for electronic circuits (PCB copper foil) is divided into two categories, namely conventional copper foil and high-performance copper foil.
Suzhou preferred electrolytic copper foil manufacturer
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above shall not exceed 8 penetration points within the area of 300ram × 300mm; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
Suzhou preferred electrolytic copper foil manufacturer
The copper clad laminate is composed of copper foil, reinforcement material and adhesive. Plates are usually classified according to the reinforcement material category and adhesive category or plate characteristics.
Suzhou preferred electrolytic copper foil manufacturer
Calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than those of electrolytic copper foil, and the copper purity is also higher than that of electrolytic copper foil.
Suzhou preferred electrolytic copper foil manufacturer
Ultra thin copper foil is used for portable electronic products such as mobile phones and laptops. Multilayer boards containing micro buried and blind vials and BGA, CSP and other organic resin packaging substrates are used to promote thin foil and ultra-thin foil. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
