Shantou Optimized Ultra thin Copper Foil Processing
If the surface stain is caused by environmental problems, the cleaning and improvement of the air conditioning filter system should be strengthened, or the wind speed should be reduced, and the small hairs on the air conditioning filter bag must be completely removed. And the fibers and powders on the polymer materials must be completely removed, which are very easy to cause stains. The air supply pipeline is easy to use plastic material, which does not produce fiber and is easy to clean with water, acid and alkali.
Shantou Optimized Ultra thin Copper Foil Processing
Ultra thin copper foil is used for portable electronic products such as mobile phones and laptops. Multilayer boards containing micro buried and blind vials and BGA, CSP and other organic resin packaging substrates are used to promote thin foil and ultra-thin foil. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Shantou Optimized Ultra thin Copper Foil Processing
Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.
Shantou Optimized Ultra thin Copper Foil Processing
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
Shantou Optimized Ultra thin Copper Foil Processing
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
